OSN 1800 V Pro

 Appearance

 Dimensions (H x W x D)

221.5 mm x 442 mm x 220 mm (excluding mounting ears)

 Weight (empty configuration, excluding packaging materials and system control boards)

• 10.6 kg (DC chassis)
• 12.3 kg (AC chassis: dual power modules)
• 14.5 kg (AC chassis: four power modules)

 Installation mode

• 19-inch cabinet

• ETSI 300 mm cabinet, such as A63B, N63B, and N63E

 Number of slots for service boards

• DC chassis: 14

• AC chassis: 12

 Optical switching capability

1- to 9-degree ROADM

 OTN cross-connect capacity

K5SXCH: 2.8 Tbit/s

K5XCH: 2.4 Tbit/s

K6XCH: 2.8 Tbit/s

K5UXCME: 920 Gbit/s

 OSU cross-connect capacity

K5UXCME: 920 Gbit/s

 SDH cross-connect capacity

K5SXCH: 140 Gbit/s (higher-order capacity) and 20 Gbit/s (lower-order capacity)

K5UXCME: 160 Gbit/s (higher-order capacity) and 20 Gbit/s (lower-order capacity)

 Packet switching capacity

K5UXCME: 920 Gbit/s

 Maximum number of  wavelengths

DWDM

96 wavelengths

CWDM

8 wavelengths

 Center wavelength range

• DWDM: 1529.16 nm to1567.13 nm (extended C band, ITU-T G.694.1)
• CWDM: 1471 nm to 1611 nm (S+C+L band, ITU-T G.694.2)

 Supported service type

SDH/SONET, PDH, OTN, OSU, Ethernet, PCM, CPRI, SAN, video, and other services

 Maximum single-channel rate

400 Gbit/s

 Line rate

1.25 Gbit/s, 2.5 Gbit/s, 10 Gbit/s, 25 Gbit/s, 100 Gbit/s, 200 Gbit/s, 400 Gbit/s

 Pluggable optical/electrical module

• Optical module: SFP/eSFP, XFP, SFP+, QSFP+, TXFP, CFP, CFP2, QSFP28

• Electrical module: GE SFP

 Topology

P2P, chain, star, ring, ring with chain, intersecting ring, tangent ring, mesh

 Network-level protection (OTN)

Client 1+1 protection, intra-board 1+1 protection, ODUk SNCP, optical line protection, tributary SNCP, LPT, OSUflex SNCP

 Network-level protection (packet)

K5UXCME: tunnel APS, PW APS/FPS, LPT, LAG, ERPS, packet SNCP, MC-PW APS, MC-LAG, MRPS

 Network-level protection (TDM)

• SDH protection: SNCP, linear MSP, ring MSP, TPS protection, E1 SNCP, 64K SNCP, hitless protection switching, multi-path hitless protection switching

• EoS protection: LAG, DLAG, LCAS, LPT, STP/RSTP

 Device-level protection

• Cross-connect, system control, and clock integrated board redundancy

• Power supply backup

• Fan redundancy

 Encryption type

Client-side bidirectional service encryption

 TSDN

• E2E fast service provisioning
• Bandwidth on demand (BoD)
• Scheduled service provisioning (BC)
• Visualized resource utilization
• Latency map

 Optical power management

ALS, AGC, OPA, IPA

 Maintenance

• MPLS-TP OAM
• ETH OAM (packet)
• ETH OAM (EoS)
• Port mirroring (EoS)
• Loopback
• PRBS
• LLDP

 Easy O&M

Optical Doctor (OD) system, Fiber Doctor (FD) system

 Synchronization

• Physical clock (OTN&SDH & PKT)

• IEEE 1588v2 (OTN & PKT)

• ITU-T G.8275.1/G.8273.2 (OTN & PKT)

 ASON

• OTN: Electrical-layer ASON is supported when the TMK5XCH/TMK6XCH board is used.
• SDH ASON: SDH ASON is supported when the TMK5UXCME/TMK5XCS system control board is used.
• 2M ASON: 2M ASON is supported when the TMK5UXCME/TMK5XCS system control board is used.

 Operating voltage

DC power supply

• Standard operating voltage: –48 V to –60 V
• Operating voltage range: –40 V to –72 V

Device running environment

Chassis temperature

• Long term: –5°C to +50°C

• Short-term^a: –10°C to +55°C

Chassis relative humidity

• Long term: 5% to 85%

• Short term: 5% to 95%

ETSI standard

ETSI Class 3.1

Reliability

Mean time to repair (MTTR)

1 hour^b

Mean time between failures (MTBF)

52.03 years^b

Availability

99.9997806%^b

a: “Short term” refers to a maximum of 96 consecutive operating hours and a total operating time of no more than 15 days in a year.

b: The preceding parameter values are calculated based on the typical product configuration. The parameters vary according to the configuration module.