Highlights of OSN 1800 I Enhanced
-
MS-OTN compliance, supporting access of any-rate services over a single network
- A single chassis supports a maximum of 40 Gbit/s OTN capacity, 40 Gbit/s OSU capacity, 120 Gbit/s packet capacity, 42.5 Gbit/s SDH higher-order and 5 Gbit/s SDH lower-order capacities.
-
Environmentally Friendly, Power Saving, and Easy to Deploy and Maintain
- 1 U compact chassis: supports power saving and consumes low power in a typical configuration, helping customers reduce their OPEX.
- Easy to deploy and supports a broad range of applications: 19-inch or ETSI rack mounting and available in AC and DC power supplies.
- ITU-T G.709 compliant OTN inband management.
-
Distinguished architecture, high reliability, and secure data transmission
- Provides network-level protection.
- Provides equipment-level protection: fan protection.
Product Specifications (1800 I Enhanced)
Item |
Specifications |
|
---|---|---|
Dimensions (W x D x H) |
442 mm x 220 mm x 43.6 mm (excluding mounting ears) |
|
Weight (empty chassis, with PIU and FAN boards) |
2.5 kg |
|
Weight (empty chassis, with APIU and FAN boards) |
4 kg |
|
Installation mode |
|
|
Number of slots for service boards |
|
|
Electrical switching capacity
|
OTN |
40 Gbit/s |
Packet |
|
|
OSU |
40 Gbit/s |
|
TDM |
Higher-order capacity: 42.5 Gbit/s; lower-order capacity: 5 Gbit/s |
|
Maximum number of wavelengths |
DWDM |
96 wavelengths |
CWDM |
8 wavelengths |
|
Center wavelength range |
|
|
Supported service type |
OTN, OSU, SDH, PDH, Ethernet |
|
Maximum single-channel rate |
10 Gbit/s |
|
Line rate |
155 Mbit/s, 622 Mbit/s, 2.5 Gbit/s, 10 Gbit/s |
|
Pluggable optical/electrical module |
|
|
Topology |
Point-to-point, chain, star, ring, ring with chain, intersecting ring, tangent ring |
|
Network-level protection (OTN) |
ODUk SNCP, LPT, OSUflex SNCP |
|
Network-level protection (packet) |
Tunnel APS, PW APS, LPT, LAG, ERPS, packet SNCP |
|
Network-level protection (TDM) |
|
|
Device-level protection |
Fan redundancy |
|
TSDN |
|
|
Optical power management |
ALS |
|
Maintenance
|
|
|
Synchronization |
Physical clock (OTN & packet & SDH) |
|
Power supply |
DC power supply
AC power supply
|
|
Device running environment |
Chassis temperature |
|
Chassis relative humidity |
|
|
ETSI standard |
ETSI Class 3.1 NOTE: The ETSI standards define the temperature and humidity of the equipment room. |
|
Reliability |
Mean time to repair (MTTR) |
1 hourb NOTE: The MTTR is related to the specific configuration of a device, including the average time for locating a fixed fault on site, replacing a board, restarting the device, and recovering services. The traveling time is not included. |
Mean time between failures (MTBF) |
35.94 yearsb |
|
Availability |
99.9996823%b |
|
a: “Short term” refers to a maximum of 96 consecutive operating hours and a total operating time of no more than 15 days in a year. b: The preceding parameter values are calculated based on the typical product configuration. The parameters vary according to the configuration module. |
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